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Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering

Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering

MOQ: 1 Set
Preis: USD 23800-26800 Per Set
Standard Packaging: Exportieren Sie die Holzkastenverpackung
Delivery Period: 30 Arbeitstage
Payment Method: T/T, Western Union, MoneyGram
Supply Capacity: 1000 Sätze/Jahr
Detailinformationen
Herkunftsort
China
Markenname
Honeal
Modellnummer
OS-300
Dimension:
L870mm x W1230mm x H1550mm
Maximale Tragfläche:
Max: 350 (l)*300 (w) (mm)
Kaisereinstellungsbereich:
Max400 ℃
Positiongenauigkeit:
+ / - 0,05 mm
Lötmittel-Topf-Kapazität:
13 kgs /pcs
Vorwärmmethode:
IR-Oberheizung
Hervorheben:

mini desktop selective soldering machine

,

high precision automated soldering machine

,

PCB assembly wave soldering machine

Product Description
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering
Product Attributes
Attribute Value
Dimension L870mm X W1230mm X H1550mm
Max carrier size Max:350(L)*300(W)(mm)
Temperature setting range Max400 ℃
Position accuracy + / - 0.05 mm
Solder pot capacity 13 kgs /PCS
Preheat method Upper IR heating
Mini Wave Selective Soldering Machine for Electronics Production
Features:
  • The machine integrates flux spraying and soldering
  • The solder pot is fixed, and the PCB board moves to realize soldering
  • Maximum PCB dimensions: 300 x 300mm
  • Small in occupation space and low in energy consumption
  • Manual placement and removal of boards
  • It is particularly suitable for the products of NPI
Technical Parameters
Machine Parameters
Dimensions L870mm X W1230mm X H1550mm
Power supply Single phase 220V 50HZ
Shipping Parameters
Rail adjustable range 50-300MM
PCB board size L350 X W300MM
Transport height 900±30mm
Sports platform Pulley + slide rail
Movement accuracy ±0.25 mm
Tin Furnace Parameters
Crest drive Mechanical pump
Number of tin furnaces Single cylinder
Tin furnace capacity 13 kg / furnace
Nitrogen consumption About 1.5 ~2 m3/h per tin cylinder
Programmatically Manually enter coordinates
Product Details
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 0 Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 1
Certification
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 2
Packing
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 3
produits
PRODUCTS DETAILS
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering
MOQ: 1 Set
Preis: USD 23800-26800 Per Set
Standard Packaging: Exportieren Sie die Holzkastenverpackung
Delivery Period: 30 Arbeitstage
Payment Method: T/T, Western Union, MoneyGram
Supply Capacity: 1000 Sätze/Jahr
Detailinformationen
Herkunftsort
China
Markenname
Honeal
Modellnummer
OS-300
Dimension:
L870mm x W1230mm x H1550mm
Maximale Tragfläche:
Max: 350 (l)*300 (w) (mm)
Kaisereinstellungsbereich:
Max400 ℃
Positiongenauigkeit:
+ / - 0,05 mm
Lötmittel-Topf-Kapazität:
13 kgs /pcs
Vorwärmmethode:
IR-Oberheizung
Min Bestellmenge:
1 Set
Preis:
USD 23800-26800 Per Set
Verpackung Informationen:
Exportieren Sie die Holzkastenverpackung
Lieferzeit:
30 Arbeitstage
Zahlungsbedingungen:
T/T, Western Union, MoneyGram
Versorgungsmaterial-Fähigkeit:
1000 Sätze/Jahr
Hervorheben

mini desktop selective soldering machine

,

high precision automated soldering machine

,

PCB assembly wave soldering machine

Product Description
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering
Product Attributes
Attribute Value
Dimension L870mm X W1230mm X H1550mm
Max carrier size Max:350(L)*300(W)(mm)
Temperature setting range Max400 ℃
Position accuracy + / - 0.05 mm
Solder pot capacity 13 kgs /PCS
Preheat method Upper IR heating
Mini Wave Selective Soldering Machine for Electronics Production
Features:
  • The machine integrates flux spraying and soldering
  • The solder pot is fixed, and the PCB board moves to realize soldering
  • Maximum PCB dimensions: 300 x 300mm
  • Small in occupation space and low in energy consumption
  • Manual placement and removal of boards
  • It is particularly suitable for the products of NPI
Technical Parameters
Machine Parameters
Dimensions L870mm X W1230mm X H1550mm
Power supply Single phase 220V 50HZ
Shipping Parameters
Rail adjustable range 50-300MM
PCB board size L350 X W300MM
Transport height 900±30mm
Sports platform Pulley + slide rail
Movement accuracy ±0.25 mm
Tin Furnace Parameters
Crest drive Mechanical pump
Number of tin furnaces Single cylinder
Tin furnace capacity 13 kg / furnace
Nitrogen consumption About 1.5 ~2 m3/h per tin cylinder
Programmatically Manually enter coordinates
Product Details
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 0 Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 1
Certification
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 2
Packing
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 3